Size reduction, surface preparation, carbon/gold plating of various products’ and samples’ are conducted in the laboratory in order to prepare them for characterization equipment.
Equipment
- Polishing (Lam Plan MM 8027)
- Polishing (Lam Plan MM 500)
- Lapping(Lam Plan MM 835)
- Bakelite holders for samples (Lam Plan 8008)
- Metal band saw (Optimum)
- Cutting machine (Lam Plan MM 220)
- Small milling machine (SIEG)
- Grinding motor (Quantum)
- Small grinding motor (Lam Plan MM 880)
- Scale (OHAUS MB 200)
- Radiation measurement (SAIC)
